Breadboard Medium 400 Tie Points (Half-Size Solderless)
Rs. 70.00
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Breadboard Medium 400 Tie Points (Half-Size Solderless)
Rs. 70.00
Medium 400 Tie Points (Half-Size) Solderless Prototyping Breadboard
The Medium 400 Tie Points Breadboard delivers the ideal balance between compact size and prototyping capability. It features a central IC area of 300 tie points alongside 2 power distribution rails (100 tie points), making it perfectly suited for Arduino Nano, ESP8266, and compact microcontroller projects.
Key Features & Specifications:
- Total Tie Points: 400 Points (300 Terminal Tie Points + 100 Power Bus Points)
- Pin Pitch: Standard 2.54 mm (0.1") matrix
- Power Distribution: 2 Power Bus strips (+ and - color coded)
- Form Factor: Half-size, lightweight and travel-friendly
- Mounting: Peel-and-stick adhesive backing for secure baseplate mounting
- Contact Quality: Tight-grip spring clips ensuring low contact resistance
- Dimensions: Approx. 82 x 55 x 8.5 mm
Applications:
- Arduino Nano, Pro Mini, and NodeMCU ESP8266 prototyping
- Compact sensor interface modules and wearable circuits
- Small robot chassis mounting and portable electronic test jigs