Breadboard Large 830 / 800 Tie Points (MB-102 Solderless)

MB-102 Large 830 Tie Points Solderless Prototyping Breadboard

The MB-102 Large Solderless Breadboard is an indispensable tool for designing, testing, and prototyping electronic circuits without any soldering. With 830 tie points (630 IC tie-points + 200 distribution tie-points), it easily accommodates large microcontrollers, DIP ICs, transistors, sensors, and jumper wires.

Key Features & Specifications:

• Total Tie Points: 830 Points (630 Terminal Matrix Points + 200 Power Bus Points)
• Standard Pitch: 2.54 mm (0.1 inch) standard pin spacing for DIP ICs and breakout modules
• Distribution Rails: 4 Power Rails (+ and -) with clear red and blue polarity markings
• Interlocking Mechanism: Tab and slot edges allow interlocking multiple breadboards together
• Contact Material: Phosphor bronze nickel-plated spring clips (rated for 5,000+ insertions)
• Backing: Double-sided adhesive foam tape for mounting onto project chassis
• Dimensions: Approx. 165 x 55 x 8.5 mm

Applications:

• Prototyping with Arduino Uno, Mega, Raspberry Pi, and ESP32 expansion headers
• Analog and digital circuit testing (logic gates, 555 timers, op-amps)
• STEM education, college laboratories, and DIY electronics experiments